射频电路封装设计与工艺实现方法研究

苏德志; 王岑; 詹兴龙

doi:10.20193/j.ices2097-4191.2024.0072

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集成电路与嵌入式系统 ›› 2025, Vol. 25 ›› Issue (1) : 34-39. DOI: 10.20193/j.ices2097-4191.2024.0072

航天元器件可靠性研究专栏

射频电路封装设计与工艺实现方法研究

作者信息 +

Research on design and process of electrical packaging for RF circuit

Author information +

文章历史 +

摘要

通信技术与社会发展息息相关,射频电路推动了通信技术的硬件水平,并已成为射频系统研究的热点之一。射频电路与数字电路的区别在封装技术方面也有区别,本文以封装设计和工艺实现方法为研究对象,从射频电路基本原理、封装设计方法和工艺实现三个方面展开,介绍了射频电路封装的发展现状、技术需求和工艺路线,对射频电路的封装具有一定的指导意义。

Abstract

Communication technology is closely related to social development. The realization of RF circuit had promoted the level of communication technology, and had become one of the hot spots of RF circuit. The difference between RF circuit and digital circuit reflected in the packaging technology. This paper took packaging design and process as the title, and introduced the development status, technical requirements and process route of RF circuit. Electrical packaging consisted of basic principle, packaging design and implementation, which had guiding significance for RF circuit packaging.

导出引用

苏德志, 王岑, 詹兴龙. 射频电路封装设计与工艺实现方法研究[J]. 集成电路与嵌入式系统. 2025, 25(1): 34-39 https://doi.org/10.20193/j.ices2097-4191.2024.0072

SU Dezhi, WANG Cen, ZHAN Xinglong. Research on design and process of electrical packaging for RF circuit[J]. Integrated Circuits and Embedded Systems. 2025, 25(1): 34-39 https://doi.org/10.20193/j.ices2097-4191.2024.0072

中图分类号： TN454 (微波混合集成电路(微波集成电路))

参考文献

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