扇出型晶圆级封装重布线层互联结构失效分析
范懿锋, 明雪飞, 曹瑞, 王智彬, 孟猛
Failure analysis of interconnect structure in redistribution layer of fan-out wafer level packaging
FAN Yifeng, MING Xuefei, CAO Rui, WANG Zhibin, MENG Meng
集成电路与嵌入式系统
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2024, (7): 43
-47
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DOI: 10.20193/j.ices2097-4191.2024.07.007
