Timing optimization design of ASIC chip based on buffer

ZHANG Xiang, ZHAO Qilin

Integrated Circuits and Embedded Systems ›› 2024, Vol. 24 ›› Issue (12) : 33-37.

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Integrated Circuits and Embedded Systems ›› 2024, Vol. 24 ›› Issue (12) : 33-37. DOI: 10.20193/j.ices2097-4191.2024.0046
Research Paper

Timing optimization design of ASIC chip based on buffer

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Abstract

With the rapid development of very large-scale integration IC manufacturing process and the continuous improvement of integration, the difficulty of chip timing convergence has become increasingly prominent. The significance of timing, as one of the core indexes in the physical design of digital chips, cannot be underestimated. In integrated circuit design, buffers are added to optimize fan-out and reduce interconnect latency, thereby improving timing performance. However, due to the limitations of EDA tools in predicting the position of standard cells, the method of automatically inserting buffers may be unreasonable. This study conducted an in-depth exploration of the placement and route design of an ASIC chip using Innovus as a design tool. During the placement stage, an optimized method targeted at buffer insertion was employed. The experimental results indicate that this method significantly improved the design result after placement and route, accelerating the time sequence convergence process.

Key words

timing / buffer / ASIC chip / clock tree synthesis and layout

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ZHANG Xiang , ZHAO Qilin. Timing optimization design of ASIC chip based on buffer[J]. Integrated Circuits and Embedded Systems. 2024, 24(12): 33-37 https://doi.org/10.20193/j.ices2097-4191.2024.0046

References

[1]
陈春章, 艾霞, 王国雄. 数字集成电路物理设计[M]. 北京: 科学出版社, 2008.
CHEN C Z, AI X, WANG G X. Physical design of digital integrated circuits[M]. Beijing: Science Press, 2008 (in Chinese).
[2]
赵旭初, 施隆照. 一种触摸及显示专用芯片后端设计[J]. 电子技术, 2017, 46(4):58-62.
ZHAO X C, SHI L Z. Back-end Design of a ASIC for Touch and Display[J]. Electronic Technology, 2017, 46(4):58-62 (in Chinese).
[3]
马小东. DMB发射机基带ASIC芯片后端设计[D]. 重庆: 重庆邮电大学, 2022.
MA X D. Back-end design of a DMB transmitter Baseband SoC[D]. Chongqing: Chongqing University of Posts and Telecommunications, 2022 (in Chinese).
[4]
柴红燕. 基于布局优化的USB TYPE-C接口芯片数字后端设计[D]. 北京: 北京工业大学, 2018.
CHAI H Y. Digital back-end design of USB TYPE-C interface chip with optimizing floorplan and placement[D]. Beijing: Beijing University of Technology, 2018 (in Chinese).
[5]
张炬林. 基于抗辐射SRAM的数字后端研究与设计[D]. 长沙: 湖南大学, 2020.
ZHANG J L. Research and design of digital back-end based on anti-radiation SRAM[D]. Changsha: Hunan University, 2020 (in Chinese).
[6]
唐振宇, 陈咏恩. 蓝牙专用集成电路芯片及其后端实现[J]. 信息技术, 2003(9):5-7,18.
TANG Z Y, CHEN Y E. ASIC chip based on bluetooth and its back-end realization[J]. Information Technology, 2003(9):5-7,18 (in Chinese).
[7]
王仁平, 何明华, 魏榕山. 基于MCU的SoC芯片版图设计与验证[J]. 福州大学学报(自然科学版), 2011, 39(4):539-545.
WANG R P, HE M H, WEI R S. Layout design and verification of SoC chip based on MCU[J]. Journal of Fuzhou University(Natural Science Edition), 2011, 39(4):539-545 (in Chinese).
[8]
蔺蓉, 李国林, 李冬梅, 等. 无线内窥镜系统胶囊内数字芯片的后端设计[J]. 微电子学与计算机, 2007(4):8-11.
LIN R, LI G L, LI D M, et al. Back-end design of the digital ASIC for wireless endoscope capsule[J]. Microelectronics & Computer, 2007(4):8-11 (in Chinese).
[9]
王伟, 刘成, 侯立刚, 等. 光栅测量系统芯片后端物理设计与实现[J]. 微电子学, 2007(4):579-583.
WANG W, LIU C, HOU L G, et al. Back-enddesign and implementation of grating measurement SoC[J]. Microelectronics, 2007(4):579-583 (in Chinese).
[10]
刘浩. 基于7 nm工艺高性能图形芯片模块的后端设计[D]. 西安: 西安电子科技大学, 2018.
LIU H. Back-end design of high-performance graphics chip’s sub-module based on 7 nm technology[D]. Xi’an: Xidian University, 2018 (in Chinese).
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