Research on design and process of electrical packaging for RF circuit

SU Dezhi; WANG Cen; ZHAN Xinglong

doi:10.20193/j.ices2097-4191.2024.0072

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Integrated Circuits and Embedded Systems ›› 2025, Vol. 25 ›› Issue (1) : 34-39. DOI: 10.20193/j.ices2097-4191.2024.0072

Special Topic of Aerospace Component Reliability

Research on design and process of electrical packaging for RF circuit

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Abstract

Communication technology is closely related to social development. The realization of RF circuit had promoted the level of communication technology, and had become one of the hot spots of RF circuit. The difference between RF circuit and digital circuit reflected in the packaging technology. This paper took packaging design and process as the title, and introduced the development status, technical requirements and process route of RF circuit. Electrical packaging consisted of basic principle, packaging design and implementation, which had guiding significance for RF circuit packaging.

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wireless communication / RF circuit / electrical packaging / bonding process

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SU Dezhi , WANG Cen , ZHAN Xinglong. Research on design and process of electrical packaging for RF circuit[J]. Integrated Circuits and Embedded Systems. 2025, 25(1): 34-39 https://doi.org/10.20193/j.ices2097-4191.2024.0072

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