Research on design and process of electrical packaging for RF circuit

SU Dezhi, WANG Cen, ZHAN Xinglong

Integrated Circuits and Embedded Systems ›› 2025, Vol. 25 ›› Issue (1) : 34-39.

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Integrated Circuits and Embedded Systems ›› 2025, Vol. 25 ›› Issue (1) : 34-39. DOI: 10.20193/j.ices2097-4191.2024.0072
Special Topic of Aerospace Component Reliability

Research on design and process of electrical packaging for RF circuit

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2025, 25(1): 34-39 https://doi.org/10.20193/j.ices2097-4191.2024.0072

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