Thermal simulation assessment of assembly process of fan-out wafer level package based on finite element analysis

LI Peilei, ZHANG Wei, JIA Qiuyang, JIANG Maogong, GU Hantian

Integrated Circuits and Embedded Systems ›› 2024, Vol. 24 ›› Issue (7) : 37-42.

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Integrated Circuits and Embedded Systems ›› 2024, Vol. 24 ›› Issue (7) : 37-42. DOI: 10.20193/j.ices2097-4191.2024.07.006
Special Topic of Integrated Circuits Reliability

Thermal simulation assessment of assembly process of fan-out wafer level package based on finite element analysis

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2024, 24(7): 37-42 https://doi.org/10.20193/j.ices2097-4191.2024.07.006

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