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高密度混合电路封装技术发展趋势及可靠性评价方法研究
吉美宁, 常明超, 贾子健, 马保梁, 王锦, 董浩威, 范壮壮
集成电路与嵌入式系统 ›› 2024, Vol. 24 ›› Issue (7) : 25-29.
高密度混合电路封装技术发展趋势及可靠性评价方法研究
Research on the development trend and reliability evaluation method of high-density hybrid circuit packaging technology
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