基于有限元分析的扇出型晶圆级封装组装工艺热循环仿真评价
李培蕾, 张伟, 贾秋阳, 姜贸公, 谷瀚天
Thermal simulation assessment of assembly process of fan-out wafer level package based on finite element analysis
LI Peilei, ZHANG Wei, JIA Qiuyang, JIANG Maogong, GU Hantian
集成电路与嵌入式系统
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2024, (7): 37
-42
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DOI: 10.20193/j.ices2097-4191.2024.07.006
