集成电路微组装用环氧粘接胶树脂析出及控制研究
谢廷明, 廖希异, 谢换鑫, 林杨柳
An experimental study of die attach epoxy adhesive resin bleed in integrated circuits
XIE Tingming, LIAO Xiyi, XIE Huanxin, LIN Yangliu
集成电路与嵌入式系统
.
2024, (7): 48
-51
.
DOI: 10.20193/j.ices2097-4191.2024.07.008
