射频电路封装设计与工艺实现方法研究
苏德志, 王岑, 詹兴龙
Research on design and process of electrical packaging for RF circuit
SU Dezhi, WANG Cen, ZHAN Xinglong
集成电路与嵌入式系统 . 2025, (1): 34 -39 .  DOI: 10.20193/j.ices2097-4191.2024.0072