新型FPGA架构和电路设计技术展望

范继聪, 于宗光, 谢达, 单悦尔, 徐仲延

集成电路与嵌入式系统 ›› 2025, Vol. 25 ›› Issue (6) : 14-28.

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集成电路与嵌入式系统 ›› 2025, Vol. 25 ›› Issue (6) : 14-28. DOI: 10.20193/j.ices2097-4191.2025.0016
FPGA前沿技术与应用研究专刊

新型FPGA架构和电路设计技术展望

作者信息 +

Perspectives of novel FPGA architectures and circuit design technologies

Author information +
文章历史 +

摘要

与定制设计芯片相比,现场可编程门阵列(FPGA)支持硬件灵活重构,具有设计周期短和开发成本低等优势,广泛应用于通信、数据中心、人工智能、雷达和航空航天等领域。FPGA架构的设计目标是制造出高度可编程的FPGA芯片,同时最小化可重构性带来的面积和性能成本。随着应用需求和工艺技术能力的不断演变,正在迎来 FPGA 架构设计的新阶段。简述FPGA基本架构与FPGA架构评估,梳理新型FPGA架构和电路设计技术最新进展,探讨新型FPGA架构和电路设计的技术挑战和发展趋势。

Abstract

Compared to custom-designed chips, Field Programmable Gate Arrays (FPGAs) support flexible hardware reconfiguration and offer advantages such as shorter design cycles and lower development costs. They are widely used in fields such as communications, data centers, radar, and aerospace. The design of FPGA architectures aims to create highly programmable FPGA chips while minimizing the area and performance costs associated with reconfigurability. With the continuous evolution of application demands and process technology capabilities, FPGA architecture design is entering a new phase. This article briefly describes the basic architecture of FPGA with its evaluation, summarizes the latest developments in novel FPGA architectures and circuit design technologies, and discusses the technical challenges and development trends of novel FPGA architectures and circuit design.

关键词

FPGA / FPGA架构 / 可重构 / FPGA芯片 / FPGA架构评估

Key words

FPGA / FPGA architecture / reconfiguration / FPGA chip / FPGA architecture evaluation

引用本文

导出引用
范继聪, 于宗光, 谢达, . 新型FPGA架构和电路设计技术展望[J]. 集成电路与嵌入式系统. 2025, 25(6): 14-28 https://doi.org/10.20193/j.ices2097-4191.2025.0016
FAN Jicong, YU Zongguang, XIE Da, et al. Perspectives of novel FPGA architectures and circuit design technologies[J]. Integrated Circuits and Embedded Systems. 2025, 25(6): 14-28 https://doi.org/10.20193/j.ices2097-4191.2025.0016
中图分类号: TN474   

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基金

国家重点研发项目课题工艺协同设计(STCO)方法研究—AI芯片的STCO方法验证(2024YFB4405405)
江苏省自然科学基金前沿引领技术基础研究项目—跨维度、多功能功能异构集成芯粒基础技术研究(BK20232029)

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