针对模拟存算一体芯片设计中仿真验证难题,提出一种创新的数字接口设计方案,旨在提高大规模计算场景下的仿真效率。该方案分析SRAM存算一体原理,将SPICE模型与数字控制电路结合,利用数字方法完成模拟存算一体设计的仿真验证,从而提升开发效率。为验证方案的有效性,构建评估体系,对比数字接口仿真与传统模拟电路仿真。结果显示,新方案仿真速度提升2倍以上,配置效率提升1 000倍以上,优势显著。该研究获得科技部重点研发计划 (2021YFB3601300)支持,已在180 nm工艺节点完成流片验证,证实了数字接口设计方案在大规模计算场景下仿真存算一体设计的效率优势。
Neural network models demand high processor performance and energy efficiency. The memory-computing integrated architecture is an energy-efficient solution. This paper introduces a digital interface simulation scheme to address simulation verification challenges in analog memory-computing integrated designs and improve simulation efficiency in large-scale computing scenarios. The scheme analyzes SRAM-based memory-computing integration and combines the SPICE model with a digital control circuit. This enables the use of digital methods for simulation and verification, potentially boosting development efficiency. An evaluation system comparing the digital interface simulation with traditional analog circuit simulation reveals that the new solution increases simulation speed by more than 2 times and configuration efficiency by more than 1 000 times. This research is supported by the key research and development program of the ministry of science and technology (2021YFB3601300), and this research has been validated with tape-out at the 180 nm process node, demonstrating the efficiency advantages of the digital interface simulation scheme for memory-computing integrated design in large-scale computing.