基于大语言模型多智能体的端到端领域专用SoC设计

闫沛然, 支沁喆, 刘力峰, 贾天宇

集成电路与嵌入式系统 ›› 2025, Vol. 25 ›› Issue (8) : 31-40.

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集成电路与嵌入式系统 ›› 2025, Vol. 25 ›› Issue (8) : 31-40. DOI: 10.20193/j.ices2097-4191.2025.0043
新兴计算芯片设计研究专刊

基于大语言模型多智能体的端到端领域专用SoC设计

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End-to-end domain-specific SoC design with LLM-based multi-agent

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摘要

随着摩尔定律放缓,领域专用片上系统(DSSoC)集成领域专用加速器(DSA)已成为一种极具前景的高能效芯片设计策略。然而,DSSoC的设计流程高度复杂,导致开发周期漫长且人力投入巨大。大语言模型(LLMs)的最新进展为敏捷芯片设计引入了新方法,这一方法在代码生成和EDA脚本编写中展现出巨大的应用潜力。文中提出一种基于LLM的多智能体DSSoC设计框架,覆盖从架构定义到代码生成、再到EDA物理实现的端到端设计流程。最后通过两项案例研究验证了该框架在22 nm和7 nm工艺节点上,仅用2至4周即可完成两个SoC设计。相较于原有流程生成的SoC,文中方案设计的SoC能效分别提升了4.84倍和3.82倍。

Abstract

As Moore’s Law slows down, domain-specific SoC (DSSoC) has emerged as a promising energy-efficient design strategy by integrating domain-specific accelerator (DSA). However, the design process for DSSoC remains highly complex, leading to prolonged development cycles and significant labor effort. Recent advances in large language models (LLMs) have introduced new methodologies for agile chip design, demonstrating substantial potential in code and EDA script generation. In this work, an LLM-based multi-agent framework for DSSoC design is proposed, which consists of end-to-end design stages from architecture definition to code generation and EDA physical implementation. The approach is validated through two case studies involving 2-to 4-week SoC designs at process nodes of 22 nm and 7 nm. The evalautions show the generated SoCs achieve energy efficiency improvements of 4.84× and 3.82×, compared to SoCs generated by the existing framework.

关键词

敏捷设计 / 多智能体 / 端到端设计 / 领域专用片上系统 / 大语言模型

Key words

agile design / multi-agent / end-to-end design / DSSoC / large language model

引用本文

导出引用
闫沛然, 支沁喆, 刘力峰, . 基于大语言模型多智能体的端到端领域专用SoC设计[J]. 集成电路与嵌入式系统. 2025, 25(8): 31-40 https://doi.org/10.20193/j.ices2097-4191.2025.0043
YAN Peiran, ZHI Qinzhe, LIU Lifeng, et al. End-to-end domain-specific SoC design with LLM-based multi-agent[J]. Integrated Circuits and Embedded Systems. 2025, 25(8): 31-40 https://doi.org/10.20193/j.ices2097-4191.2025.0043
中图分类号: TN47 (大规模集成电路、超大规模集成电路)   

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基金

国家自然科学基金项目(U23A6007)
北京市自然科学基金—小米创新联合基金项目(L243001)

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