一种高效的双通道冗余电子控制器通道间信息交互方案研究

杨天赐, 张梓骥, 张天宏

集成电路与嵌入式系统 ›› 0

集成电路与嵌入式系统 ›› 0 DOI: 10.20193/j.ices2097-4191.2025.0099

一种高效的双通道冗余电子控制器通道间信息交互方案研究

  • 杨天赐, 张梓骥, 张天宏
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Research on an Efficient Information Exchange Scheme between Dual Channel Redundant Controllers

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摘要

针对双通道冗余电子控制器的热备份工作方式,提出了一种基于CPLD的多功能通道管理模块设计方案,实现高效的主备通道间数据交换和同步。采用串行外设接口(SPI)进行通信及同步,管理模块作为SPI通信主机,实现向主备通道的数据广播和主备通道之间的直接桥接,同时具备通信数据的监听能力。基于仿真验证,串口通信管理功能正常,SPI桥接及广播由时序逻辑带来的延时为30ns,系统实时性好;基于所设计的双通道冗余电子控制器进行了SPI数据传输功能的测试,结果表明串口回传及SPI数据交换测试中数据完整性好,满足设计要求。

Abstract

For the hot backup working mode of dual-channel redundant electronic controllers, a design scheme of a multi-functional channel management module based on CPLD is proposed to achieve efficient data exchange and synchronization between primary and backup channels. Serial Peripheral Interface (SPI) is used for communication and synchronization, with the management module serving as the SPI communication host to implement data broadcasting to both primary and backup channels and direct bridging between them, while also possessing the capability to monitor communication data. Based on simulation verification, the serial communication management functions normally, with the delay caused by timing logic in SPI bridging and broadcasting being 30ns, indicating good system real-time performance. Tests on the SPI data transmission function of the designed dual-channel redundant electronic controller show that data integrity is good in both serial loopback and SPI data exchange tests, meeting the design requirements.

关键词

电子控制器 / 双通道冗余 / 管理模块 / CPLD / 通信接口 / 热备份

Key words

Electronic controller / Dual channel redundancy / Management module / CPLD / communication interface / hot standby

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导出引用
杨天赐, 张梓骥, 张天宏. 一种高效的双通道冗余电子控制器通道间信息交互方案研究[J]. 集成电路与嵌入式系统. 0 https://doi.org/10.20193/j.ices2097-4191.2025.0099
Research on an Efficient Information Exchange Scheme between Dual Channel Redundant Controllers[J]. Integrated Circuits and Embedded Systems. 0 https://doi.org/10.20193/j.ices2097-4191.2025.0099

基金

中国航发产学研合作项目(HFZL2023CXY012)

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