前端寄存器传输级（RTL）设计是决定芯片性能、功耗与面积（PPA）的关键环节。传统设计方法往往聚焦于功能实现，缺乏对PPA的系统性优化。为此，本文提出一种面向多维度指标的寄存器传输级优化方法——DCAP协同优化模型。该模型构建了包含数据流(D)、计算单元(C)、面积管理(A)和功耗管理(P)四个维度的优化框架。以USB2.0数据链路层为实证案例，通过耦合式握手机制提升数据吞吐率，采用实时迭代的循环冗余校验架构优化计算效率，通过资源管理控制面积开销，通过优化时钟门控覆盖率降低功耗。基于TSMC 65nm工艺的后端实现结果表明：该设计在高速模式下吞吐率达到52.3MB/s（协议效率87%），功耗为0.156mW，面积为3333.6μm²，较优化前功耗降低39%，面积减少23%。综上，本文所提出的DCAP模型为数字电路设计的PPA优化问题在寄存器传输级提供了可复用的方法论指导。

Front-end RTL design is a critical phase determining a chip's performance, power, and area (PPA). Conventional methodologies often prioritize functional implementation, lacking systematic optimization for PPA metrics. To address this, this paper proposes a multi-dimensional RTL optimization approach—the DCAP co-optimization model. This model establishes a framework encompassing four dimensions: Data-path (D), Computation (C), Area-management (A), and Power-management (P). Using the USB 2.0 link layer as a case study, data throughput is enhanced via a coupled handshake scheme, computational efficiency is optimized using a real-time iterative CRC architecture, area overhead is controlled through resource management, and power consumption is reduced by improving clock gating coverage. Back-end implementation results based on TSMC 65nm technology demonstrate that the design achieves a throughput of 52.3 MB/s (protocol efficiency:87%) in High-Speed mode, with a power consumption of 0.156 mW and an area of 3333.6 μm². Compared to the pre-optimized design, this represents a 39% reduction in power and a 23% reduction in area. In conclusion, the proposed DCAP model provides a reusable methodological guide for addressing PPA optimization challenges in digital circuit design at the register-transfer level.