随着电子封装技术不断向高密度、高集成度方向发展，FC-CCGA封装因其优越的电热性能和I/O密度，在宇航等高可靠领域应用日益广泛。而该类封装在服役期间需承受发射阶段的振动载荷和在轨阶段的温度循环载荷，其核心连接部件易因应力累积引发热疲劳失效，直接威胁封装器件的可靠性与使用寿命。本文基于Anand模型，构建了涵盖芯片凸点、焊柱、环氧胶及PCB板的电装三维模型，系统研究了FC-CCGA封装器件焊柱和凸点的振动可靠性和热疲劳可靠性。研究中开展了电装模型加固前后冲击响应谱分析，通过模拟关键焊柱和凸点在温度循环载荷下的应力-应变响应，分析了焊柱和凸点中的塑性应变分布与演变规律，并基于Coffin-Manson模型预测了焊柱和凸点的热疲劳寿命。对板级封装后的器件进行了温度循环试验，并观察了不同循环次数下焊柱的外观形貌变化，试验结果与仿真预测相符，研究结果为高可靠性应用场景下焊柱结构的优化设计与寿命评估提供了理论依据与方法支撑。

As electronic packaging technology advances towards high-density and highly integrated configurations, FC-CCGA packages are increasingly adopted in aerospace and other high-reliability applications due to their superior electrical and thermal performance and I/O density. These packages must withstand vibrational loads during launch and thermal cycling during in-orbit operation, with their core interconnect components susceptible to stress accumulation leading to thermomechanical fatigue failure, directly threatening the reliability and lifespan of the package devices. This study, based on the Anand model, constructs a comprehensive electro-mechanical 3D model encompassing chip bumps, solder columns, epoxy resin, and PCB substrate, systematically investigating the vibration and thermal fatigue reliability of FC-CCGA solder joints and bumps. The analysis includes impact response spectrum assessments pre- and post-electrical reinforcement, simulating the stress-strain response of critical solder joints and bumps under thermal cycling loads, and evaluating the plastic strain distribution and evolution over time. Additionally, the Coffin-Manson model is employed to predict thermomechanical fatigue life of the solder joints and bumps. Temperature cycling tests on packaged devices were conducted, observing morphological changes in solder joints at varying cycle counts; the experimental results align with simulation predictions, providing a theoretical basis and methodological support for optimizing solder joint structures and assessing their lifespan for high-reliability applications.