为满足无人平台对合成孔径雷达（SAR）系统小型化、国产化的要求，本文基于异构集成系统级封装（SiP）技术，研制了一款集成FPGA、DSP、DDR3及LDO的高速成像微系统。通过开展电、热、力仿真，验证了系统在信号完整性、散热性能与结构可靠性方面设计有效性。电学仿真表明，DDR3-1600MT/s与5 GT/s SerDes关键信号的插损、回损与串扰均满足设计要求；热仿真确认加载冷板条件下芯片结温可控；力学分析显示封装在温度循环与振动冲击载荷下产生的应力低于材料极限强度。成像实验结果表明，实测数据与MATLAB仿真结果高度一致，峰值旁瓣比等关键指标达到预期，验证了该系统在无人平台轻量化、高性能信息处理中的实用价值。

To address the demand for miniaturized, and low-power Synthetic Aperture Radar (SAR) systems in unmanned platforms, this study developed a high-speed imaging micro-system leveraging heterogeneous System-in-Package (SiP) technology. The system integrates an FPGA, a DSP, multiple DDR3 memory chips, and a LDO. Comprehensive electrical, thermal, and mechanical simulations validated the system’s signal integrity, thermal management, and structural robustness. Electrical simulations confirmed that key signals of DDR3-1600MT/s and 5 GT/s SerDes meet design requirements in terms of insertion loss, return loss, and crosstalk. Thermal simulations verified that the junction temperature of chips remains controllable with the application of a cold plate. Mechanical analysis demonstrated that the stress under thermal cycling and vibration shock conditions remains below the material limits. Imaging experiments showed close agreement between point-target responses, real-world data, and MATLAB simulations, with key metrics such as Peak Side Lobe Ratio (PSLR) meeting performance targets. These results demonstrate the micro-system’s viability for enabling lightweight, high-performance SAR processing in unmanned platforms.