MCU电磁干扰失效分析与软硬件解决方法

温禄泉

集成电路与嵌入式系统 ›› 2023, Vol. 23 ›› Issue (6) : 24-27.

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PDF(2599 KB)
集成电路与嵌入式系统 ›› 2023, Vol. 23 ›› Issue (6) : 24-27.
专题论述

MCU电磁干扰失效分析与软硬件解决方法

  • 温禄泉
作者信息 +

Failure Analysis and Hardware and Software Solution of MCU Electromagnetic Interference

  • Wen Luquan
Author information +
文章历史 +

摘要

介绍了一个在电磁干扰下的MCU失效案例,通过展示一步步的调试分析以及完成多个对比论证实验,在最终寻求到多种解决方案的同时,也深入体验到不同厂家芯片间的差距。文中对Flash等待周期的影响进行了探讨与论述,由于各厂家在其用户手册都未对此做过多的原理与作用上的阐述,很多用户一知半解、生搬硬套,然而这个概念在各种干扰场景下的理解与使用却有着非常重要的作用。

Abstract

In the paper,a case of MCU failure under electromagnetic interference is introduced.Through demonstrating step-by-step debugging analysis and completing multiple comparative demonstration experiments,we can finally find a variety of solutions,and also deeply experience the gap between chips from different manufacturers.The impact of the Flash waiting period is discussed and discussed in a large space in the article.Because the manufacturers have not explained too much about the principle and function of this in their user manuals,many users have a half-understanding of it and apply it mechanically,and the understanding and use of this concept in various interference scenarios plays a very important role.

关键词

MCU / STM32 / Flash等待周期 / 电磁干扰

Key words

MCU / STM32 / Flash waiting period / electromagnetic interference

引用本文

导出引用
温禄泉. MCU电磁干扰失效分析与软硬件解决方法[J]. 集成电路与嵌入式系统. 2023, 23(6): 24-27
Wen Luquan. Failure Analysis and Hardware and Software Solution of MCU Electromagnetic Interference[J]. Integrated Circuits and Embedded Systems. 2023, 23(6): 24-27
中图分类号: T62   

参考文献

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