针对PCB多板互联的非理想连接以及多电源电压的压降损失,提出了一种基于电源分配网络的仿真设计方法,对由底板12 V输入电压逐级降压至核心板主芯片的1.1 V、1.5 V供电电压的电源网络进行仿真分析。主要涉及3个方面:①直流压降,通过选择ESR更低的电感器、加宽主控芯片电源引脚的覆铜面积等措施使得主控芯片的IR Drop从226.24 mV降至41.10 mV;②电流密度,仿真得到电流密度为70.40 A/mm²,低于100 A/mm²,符合设计标准;③过孔通流能力,增加过孔数量使得过孔处电流从1.172 A降至0.556 A。仿真结果表明,此方法有效降低了多板互联PCB电路潜在的压降损失风险,提高了电源系统的可靠性和稳定性。

Aiming at the non-ideal connection of multi-board interconnection of PCB and the IR Drop loss of multi-power supply voltage,a power distribution network based on PCB is proposed.The simulation analysis of the power supply network from the 12 V input voltage of the base plate step by step down to the supply voltage of the main chip of the core board 1.1 V and 1.5 V.It mainly involves three aspects:DC voltage Drop,the IR Drop of the main control chip is reduced from 226.24 mV to 41.10 mV by choosing inductors with lower ESR and broadening the copper covering area of the power pin of the main control chip.Current density,the current density obtained by simulation is 70.40 A/mm², less than 100 A/mm².The through-hole flow capacity,increase the number of through-holes,so that the current at the through-hole decreases from the highest 1.172 A to the highest 0.556 A.The simulation results show that this method can effectively reduce the potential voltage drop loss risk of multi-board connected PCB circuit and improve the reliability and stability of power system.