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PDF(13507 KB)
PDF(13507 KB)
基于横向耦合和正交耦合的基片集成波导超宽阻带滤波功分器
Ultra wide stopband substrate integrated waveguide filter power divider based on the lateral coupling and orthogonal coupling
基片集成波导滤波功分器在通信系统中的应用逐渐广泛。与传统波导谐振器相同,基片集成波导谐振器含有多个传输模式,导致基片集成波导滤波器的宽阻带特性很难实现。本文设计了一种由电激励实现的超宽阻带基片集成波导滤波功分器。具体地,提出了一种基于电磁交替耦合拓扑的四阶基片集成波导滤波功分器,具有电输入和电输出端口。横向耦合通过谐振腔侧边开窗实现磁耦合,纵向耦合通过在相邻两腔之间的耦合窗口中蚀刻S槽线实现电耦合。通过正交传输路径可以抑制多个高阶模式,仿真和测量结果表明,阻带带宽分别大于9f0和3.1f0范围,该中心频率为35.5 GHz的滤波功分器的带外抑制效果优于-20 dB。上述方法经实物验证,试验结果与仿真结果吻合。
Substrate integrated waveguide (SIW) filter power dividers (FPDs) are widely used in communication systems.Similar to traditional waveguide resonators,SIW resonators contain numerous transmission modes,which makes the wide stopband characteristics of SIW FPDs difficult to achieve.In this paper,a substrate integrated waveguide filter power divider with ultra-wide resistance implemented by electric excitation is designed.Specifically,a forth-order substrate integrated waveguide filter power divider based on electromagnetic alternating coupling topology with electrical input and electrical output ports is proposed.The lateral coupling is achieved by opening a window on the side of the resonator to achieve magnetic coupling,and the longitudinal coupling is achieved by etching an S-slot line in the coupling window between two adjacent cavities.Multiple higher-order modes can be suppressed through the orthogonal transmission path,so that the simulation and measurement results show that the out-of-band suppression effect of the filter power divider with a center frequency of 35.5 GHz is better than -20 dB respectively in the stopband bandwidths greater than 9f0 and 3.1f0.The experimental results are in good agreement with the simulation results.
基片集成波导滤波功分器 / 宽阻带 / 横向耦合 / 正交耦合 / 电磁混合耦合
substrate integrated waveguide (SIW) filter power divider (FPD) / wide stopband / lateral coupling / orthogonal coupling / electromagnetic hybrid coupling
| [1] |
李韬, 杨惠, 厉俊男, 等. ChipletNP:基于芯粒的敏捷可定制网络处理器架构[J]. 计算机研究与发展, 2023,1-15.
|
| [2] |
杜源, 徐志航, 徐永烨, 等. 面向CMOS图像传感器芯片的3D芯粒(Chiplet)非接触互联技术[J]. 电子与信息学报, 2023, 45(11):1-7.
|
| [3] |
李应选. Chiplet的现状和需要解决的问题[J]. 微电子学与计算机, 2022, 39(5):1-9.
|
| [4] |
|
| [5] |
|
| [6] |
|
| [7] |
|
| [8] |
蒋琦天, 李国辉, 肖寅川, 等. 具有阻抗变换的平衡到非平衡威尔金森功分器[J]. 工业控制计算机, 2023, 36(7):124-126.
|
| [9] |
|
| [10] |
|
| [11] |
|
| [12] |
|
| [13] |
|
| [14] |
|
| [15] |
|
| [16] |
|
| [17] |
|
| [18] |
|
/
| 〈 |
|
〉 |