基于内嵌式微通道芯片散热结构设计研究综述

熊园园, 刘沛, 付予, 焦斌斌, 芮二明

集成电路与嵌入式系统 ›› 2024, Vol. 24 ›› Issue (7) : 12-18.

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集成电路与嵌入式系统 ›› 2024, Vol. 24 ›› Issue (7) : 12-18. DOI: 10.20193/j.ices2097-4191.2024.07.002
集成电路可靠性研究专栏

基于内嵌式微通道芯片散热结构设计研究综述

作者信息 +

Review of research on the design of heat dissipation structures based on embedded microchannel chips

Author information +
文章历史 +

摘要

电子芯片/系统的尺寸微型化、功能复合化导致了其功率密度的增大,伴随着发热也越来越严重,如何应对电子芯片/系统逐渐增加的热流密度,成为散热设计中面临的巨大挑战,也是当前研究的热点。本文详细论述了传统散热技术的优缺点,对国内外正在开展的内嵌式微通道散热结构进行了系统分析,并着重对基于内嵌式微通道芯片散热技术原理、散热性能和创新性解决方案进行了归纳总结。在分析当前国内外解决方案的基础上,总结了基于内嵌式微通道的芯片散热设计经验和结论,以及面临的挑战,基于此给出了芯片散热设计研究现状和发展方向。

Abstract

Miniaturization of chip/system dimensions and functional composites have led to an increase in power density, accompanied by the growth in heat generation. Addressing this problem has become a great challenge in thermal design and a current research hotspot. This paper discusses the advantages and disadvantages of traditional heat dissipation techniques, and systematically analyzes the embedded microchannel heat dissipation structures at home and abroad. The article focuses on summarizing the principles, thermal performance and innovative solutions of heat dissipation technology based on embedded microchannel chips. Current domestic and international solutions are analyzed, and we summarize the experiences and conclusions of chip thermal design based on embedded microchannels, along with the challenges faced. Finally, the current status and future directions of chip thermal design research are presented.

关键词

芯片散热 / 内嵌式微通道 / 热流密度 / 散热结构 / 分层复杂歧管

Key words

chip heat dissipation / embedded microchannel / heat flux density / radiator structure / the layered manifold microchannel array structure

引用本文

导出引用
熊园园, 刘沛, 付予, . 基于内嵌式微通道芯片散热结构设计研究综述[J]. 集成电路与嵌入式系统. 2024, 24(7): 12-18 https://doi.org/10.20193/j.ices2097-4191.2024.07.002
XIONG Yuanyuan, LIU Pei, FU Yu, et al. Review of research on the design of heat dissipation structures based on embedded microchannel chips[J]. Integrated Circuits and Embedded Systems. 2024, 24(7): 12-18 https://doi.org/10.20193/j.ices2097-4191.2024.07.002
中图分类号: TP872 (远距离控制和信号、远距离控制和信号系统)   

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