电子产品向小型化、智能化方向演进已是必然的发展趋势,高密度集成电路封装技术是实现产品小型化的关键技术。本文对高密度混合集成电路封装技术进行了深入研究,从基板选择、结构设计和散热设计等方面对高密度混合集成电路的封装设计进行了论述。在此基础上,结合国外非气密性混合集成电路保证要求,文章进一步研究了高密度非气密混合集成电路的可靠性评价方法,并通过应用实例说明了评价方法的有效性,可作为国产化非气密性集成电路质量保证体系建设的参考。

The evolution of electronic products towards miniaturization and intelligence is an inevitable development trend. High-density integrated circuit packaging technology is a key technology to achieve miniaturization of the product. In this paper, the packaging technology of high-density hybrid integrated circuit is studied. The packaging design of high-density hybrid integrated circuit is discussed from the aspects of substrate selection, structure design and heat dissipation design. On this basis, combined with the reliability requirements for non-hermetic hybrid integrated circuits, the article further studies the reliability evaluation method of high-density and non-hermetic hybrid integrated circuits. The effectiveness of the evaluation method is illustrated through practical examples. It can be used as a reference for the quality assurance system construction of domestic non-hermetic integrated circuits.