本文对扇出型晶圆级封装(Fan-out Wafer Level Package, FOWLP)组装工艺的热可靠性进行仿真评价,对关键技术及失效机理进行分析,针对某款基于该项技术的典型封装结构,建立其1/4结构有限元仿真模型,并对在典型军用温度循环条件下的热可靠性进行仿真分析。通过分析FOWLP关键结构在典型航天器用热循环条件下的应力及位移情况,确定了可能引起扇出型晶圆级封装失效的可靠性薄弱点。

This paper evaluates the thermal reliability of assembly process of Fan-out Wafer Level Package based on simulation. Firstly, we briefly introduce the critical technologies of Fan-out wafer level package and analyze the possible failure mechanism of these advanced packaging technologies. Then, for a typical package structure based on Fan-out wafer level package technology, the 1/4 structure finite element model is established. The simulation of the critical structure under the typical military thermal cycling condition is conducted. By analyzing the stress and displacement of the key structures of the package, potential reliability vulnerabilities leading to failure of fan-out wafer-level packaging have been identified.