环氧粘接胶常用作集成电路粘接材料。在其固化过程中,经常观察到树脂析出现象。树脂析出物会沾污键合区,带来键合可靠性问题。本文利用接触角的方法研究了树脂析出的机理,讨论了基板粗糙度和树脂析出的关系,初步得出真空烘培对于树脂析出有较大影响,而基板粗糙度和树脂析出的严重程度无必然关联。

The use of epoxy adhesive die attach material in integrated circuits is gaining popularity. Die attach epoxy adhesive resin bleed is commonly observed during the curing process. A reliability issue for wirebonding will occur if the material spreads over an area where wirebonding is to be performed. In this paper, an approach involving contact angle measurement is used to determine the mechanism of resin bleed. In addition, the effect of roughness of the substrate on resin bleed is also discussed. Priliminary results suggest that vacuum baking plays a significant role in resin bleed while no correlation was seen with roughness of substrate.