Design of Digital Communication Module of Data Transmission Link

Zhang Yan, Wen Feng, Jia Xingzhong

Integrated Circuits and Embedded Systems ›› 2022, Vol. 22 ›› Issue (3) : 78-82.

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Integrated Circuits and Embedded Systems ›› 2022, Vol. 22 ›› Issue (3) : 78-82.
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Design of Digital Communication Module of Data Transmission Link

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2022, 22(3): 78-82

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