Design of Ultrasonic Array Temperature Measurement System Based on ZYNQ7020

Zhang Kai, Wang Liming, Li Wei, Shi Runzhuo, Li Qiang

Integrated Circuits and Embedded Systems ›› 2023, Vol. 23 ›› Issue (1) : 67-70.

PDF(1359 KB)
PDF(1359 KB)
Integrated Circuits and Embedded Systems ›› 2023, Vol. 23 ›› Issue (1) : 67-70.
APPLICATION NOTES

Design of Ultrasonic Array Temperature Measurement System Based on ZYNQ7020

    {{javascript:window.custom_author_en_index=0;}}
  • {{article.zuoZhe_EN}}
Author information +
History +

HeighLight

{{article.keyPoints_en}}

Abstract

{{article.zhaiyao_en}}

Key words

QR code of this article

Cite this article

Download Citations
{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2023, 23(1): 67-70

References

References

{{article.reference}}

Funding

RIGHTS & PERMISSIONS

{{article.copyrightStatement_en}}
{{article.copyrightLicense_en}}
PDF(1359 KB)

Accesses

Citation

Detail

Sections
Recommended

/