Simulation Analysis of IC Signal Integrity Based on Flip Chip Structure

Li Shaocong, Yang Lu, Lv Junwen, Yan Huixin

Integrated Circuits and Embedded Systems ›› 2023, Vol. 23 ›› Issue (10) : 12-15.

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Integrated Circuits and Embedded Systems ›› 2023, Vol. 23 ›› Issue (10) : 12-15.
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Simulation Analysis of IC Signal Integrity Based on Flip Chip Structure

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2023, 23(10): 12-15

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