Research on UAV Interactive Technology of High-voltage Tower Acceptance Based on AR Technology

Zhang Sijiang, Li Zhengfa, Huang Linke, Wang Zhenghui, Zhang Dongsheng

Integrated Circuits and Embedded Systems ›› 2023, Vol. 23 ›› Issue (6) : 57-60.

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Integrated Circuits and Embedded Systems ›› 2023, Vol. 23 ›› Issue (6) : 57-60.
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Research on UAV Interactive Technology of High-voltage Tower Acceptance Based on AR Technology

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2023, 23(6): 57-60

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