Fast shape filling algorithm for circular features in high-density PCB

FANG Jingke, XU Ning, ZHANG Xuelin, SUN Xianwei, HU Jianguo

Integrated Circuits and Embedded Systems ›› 2024, Vol. 24 ›› Issue (1) : 39-45.

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PDF(2108 KB)
Integrated Circuits and Embedded Systems ›› 2024, Vol. 24 ›› Issue (1) : 39-45.
Special Topic of EDA Research

Fast shape filling algorithm for circular features in high-density PCB

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