Review of research on the design of heat dissipation structures based on embedded microchannel chips
XIONG Yuanyuan, LIU Pei, FU Yu, JIAO Binbin, RUI Erming
Integrated Circuits and Embedded Systems ›› 2024, Vol. 24 ›› Issue (7) : 12-18.
Review of research on the design of heat dissipation structures based on embedded microchannel chips
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