Quality and reliability evaluation methods for TSV silicon interposers based on assurance forward movement

LIU Yingying, LIU Pei, FU Wanyue, FU Yu, ZHANG Likang

Integrated Circuits and Embedded Systems ›› 2024, Vol. 24 ›› Issue (7) : 19-24.

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Integrated Circuits and Embedded Systems ›› 2024, Vol. 24 ›› Issue (7) : 19-24.
Special Topic of Integrated Circuits Reliability

Quality and reliability evaluation methods for TSV silicon interposers based on assurance forward movement

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2024, 24(7): 19-24

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