Research on the development trend and reliability evaluation method of high-density hybrid circuit packaging technology

JI Meining, CHANG Mingchao, JIA Zijian, MA Baoliang, WANG Jin, DONG Haowei, FAN Zhuangzhuang

Integrated Circuits and Embedded Systems ›› 2024, Vol. 24 ›› Issue (7) : 25-29.

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Integrated Circuits and Embedded Systems ›› 2024, Vol. 24 ›› Issue (7) : 25-29.
Special Topic of Integrated Circuits Reliability

Research on the development trend and reliability evaluation method of high-density hybrid circuit packaging technology

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2024, 24(7): 25-29

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