Failure analysis of interconnect structure in redistribution layer of fan-out wafer level packaging

FAN Yifeng, MING Xuefei, CAO Rui, WANG Zhibin, MENG Meng

Integrated Circuits and Embedded Systems ›› 2024, Vol. 24 ›› Issue (7) : 43-47.

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PDF(22180 KB)
Integrated Circuits and Embedded Systems ›› 2024, Vol. 24 ›› Issue (7) : 43-47.
Special Topic of Integrated Circuits Reliability

Failure analysis of interconnect structure in redistribution layer of fan-out wafer level packaging

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2024, 24(7): 43-47

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