An experimental study of die attach epoxy adhesive resin bleed in integrated circuits

XIE Tingming, LIAO Xiyi, XIE Huanxin, LIN Yangliu

Integrated Circuits and Embedded Systems ›› 2024, Vol. 24 ›› Issue (7) : 48-51.

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Integrated Circuits and Embedded Systems ›› 2024, Vol. 24 ›› Issue (7) : 48-51.
Special Topic of Integrated Circuits Reliability

An experimental study of die attach epoxy adhesive resin bleed in integrated circuits

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2024, 24(7): 48-51

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