Applications and major challenges of glass core substrate for chiplet integration

CHEN Changhao; XU Shimeng; LIN Pengrong

doi:10.20193/j.ices2097-4191.2025.0025

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Integrated Circuits and Embedded Systems ›› 2025, Vol. 25 ›› Issue (9) : 1-13. DOI: 10.20193/j.ices2097-4191.2025.0025

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Applications and major challenges of glass core substrate for chiplet integration

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Abstract

The growing demand for massive data processing such as artificial intelligence has greatly promoted the development of chiplet integration technology, which further imposes technical requirements on FC-BGA substrates, including large size, low warpage, electrical performance and high reliability. The late-model glass core substrate has attracted extensive attention owing to its intrinsic low dielectric coefficient, high thermal stability and chemical inertness. However, current glass core substrate technology remains in the initial stage of mass production, lacking comprehensive, reliable and standardized methods of producation, application and testing. This article overviews the history, characteristics, and present challenges of glass core substrate. It also provides a summary and prospect on the future applications of glass core substrate in chiplet integration.

Key words

chiplet integration / glass core substrate / through glass vias

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CHEN Changhao , XU Shimeng , LIN Pengrong. Applications and major challenges of glass core substrate for chiplet integration[J]. Integrated Circuits and Embedded Systems. 2025, 25(9): 1-13 https://doi.org/10.20193/j.ices2097-4191.2025.0025

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