Electrostatic-based fixed-outline floorplanning considering module flipping and whitespace redistribution

LIU Duanxiang, HUANG Fuxing, LI Xingquan, ZHU Wenxing

Integrated Circuits and Embedded Systems ›› 2024, Vol. 24 ›› Issue (1) : 46-57.

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Integrated Circuits and Embedded Systems ›› 2024, Vol. 24 ›› Issue (1) : 46-57. DOI: 10.20193/j.ices2097-4191.2024.01.007
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Electrostatic-based fixed-outline floorplanning considering module flipping and whitespace redistribution

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2024, 24(1): 46-57 https://doi.org/10.20193/j.ices2097-4191.2024.01.007

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