Review of research on the design of heat dissipation structures based on embedded microchannel chips

XIONG Yuanyuan, LIU Pei, FU Yu, JIAO Binbin, RUI Erming

Integrated Circuits and Embedded Systems ›› 2024, Vol. 24 ›› Issue (7) : 12-18.

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PDF(10749 KB)
Integrated Circuits and Embedded Systems ›› 2024, Vol. 24 ›› Issue (7) : 12-18. DOI: 10.20193/j.ices2097-4191.2024.07.002
Special Topic of Integrated Circuits Reliability

Review of research on the design of heat dissipation structures based on embedded microchannel chips

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2024, 24(7): 12-18 https://doi.org/10.20193/j.ices2097-4191.2024.07.002

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