Design of FPGA Data Link Communication Module and Data Transmission

Zhao Lingdou, Ren Yongfeng, Jia Xingzhong

Integrated Circuits and Embedded Systems ›› 2023, Vol. 23 ›› Issue (1) : 54-58.

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Integrated Circuits and Embedded Systems ›› 2023, Vol. 23 ›› Issue (1) : 54-58.
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Design of FPGA Data Link Communication Module and Data Transmission

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2023, 23(1): 54-58

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