Power Integrity Analysis of High-speed PCB Multi-board Interconnection

Niu Sen, Zhang Minjuan, Yin Ziyan

Integrated Circuits and Embedded Systems ›› 2023, Vol. 23 ›› Issue (9) : 41-44.

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PDF(1595 KB)
Integrated Circuits and Embedded Systems ›› 2023, Vol. 23 ›› Issue (9) : 41-44.
TECHNOLOGY REVIEW

Power Integrity Analysis of High-speed PCB Multi-board Interconnection

  • Niu Sen, Zhang Minjuan, Yin Ziyan
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Abstract

Aiming at the non-ideal connection of multi-board interconnection of PCB and the IR Drop loss of multi-power supply voltage,a power distribution network based on PCB is proposed.The simulation analysis of the power supply network from the 12 V input voltage of the base plate step by step down to the supply voltage of the main chip of the core board 1.1 V and 1.5 V.It mainly involves three aspects:DC voltage Drop,the IR Drop of the main control chip is reduced from 226.24 mV to 41.10 mV by choosing inductors with lower ESR and broadening the copper covering area of the power pin of the main control chip.Current density,the current density obtained by simulation is 70.40 A/mm2, less than 100 A/mm2.The through-hole flow capacity,increase the number of through-holes,so that the current at the through-hole decreases from the highest 1.172 A to the highest 0.556 A.The simulation results show that this method can effectively reduce the potential voltage drop loss risk of multi-board connected PCB circuit and improve the reliability and stability of power system.

Key words

PCB / power integrity / IR Drop / current density / through-hole flow capacity / CS3516

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Niu Sen, Zhang Minjuan, Yin Ziyan. Power Integrity Analysis of High-speed PCB Multi-board Interconnection[J]. Integrated Circuits and Embedded Systems. 2023, 23(9): 41-44

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