Power Integrity Analysis of High-speed PCB Multi-board Interconnection

Niu Sen, Zhang Minjuan, Yin Ziyan

Integrated Circuits and Embedded Systems ›› 2023, Vol. 23 ›› Issue (9) : 41-44.

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Integrated Circuits and Embedded Systems ›› 2023, Vol. 23 ›› Issue (9) : 41-44.
TECHNOLOGY REVIEW

Power Integrity Analysis of High-speed PCB Multi-board Interconnection

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2023, 23(9): 41-44

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