Fast shape filling algorithm for circular features in high-density PCB

FANG Jingke, XU Ning, ZHANG Xuelin, SUN Xianwei, HU Jianguo

Integrated Circuits and Embedded Systems ›› 2024, Vol. 24 ›› Issue (1) : 39-45.

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Integrated Circuits and Embedded Systems ›› 2024, Vol. 24 ›› Issue (1) : 39-45. DOI: 10.20193/j.ices2097-4191.2024.01.006
Special Topic of EDA Research

Fast shape filling algorithm for circular features in high-density PCB

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2024, 24(1): 39-45 https://doi.org/10.20193/j.ices2097-4191.2024.01.006

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