Research on the heterogeneous integrated interconnect interface

LI Peijie; LIU Qinrang; CHEN Ting; SHEN Jianliang; LV Ping; GUO Wei

doi:10.20193/j.ices2097-4191.2024.02.004

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Integrated Circuits and Embedded Systems ›› 2024, Vol. 24 ›› Issue (2) : 31-40. DOI: 10.20193/j.ices2097-4191.2024.02.004

Special Topic of Chiplet Research

Research on the heterogeneous integrated interconnect interface

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Abstract

With the development of integrated circuits to the Beyond Moor era,the heterogeneous integration technology has become an emerging direction of microelectronics.The interconnect interface,the key to the heterogeneous integration technology, is critical to heterogeneous integrated chip and system.In order to promote the implementation of heterogeneous integrated interconnect interface, the structure of the heterogeneous integrated chip and system is described and the heterogeneous integration technology is summarized into four technical routes:large chip by integrated chiplets, larger chip by integrated large chips,wafer-level chips and wafer-level systems. The characteristics of the heterogeneous integrated interconnect interface are summarized.The current research status and existing problems in the industry and academia around the heterogeneous integrated interconnect interface are analyzed.Finally,the future development trend and the needed technical characteristics of the heterogeneous integrated interconnect interface are given by this article.

Key words

heterogeneous integration / advanced packaging / Chiplet technology / system on wafer / interconnect interface

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LI Peijie , LIU Qinrang , CHEN Ting , et al . Research on the heterogeneous integrated interconnect interface[J]. Integrated Circuits and Embedded Systems. 2024, 24(2): 31-40 https://doi.org/10.20193/j.ices2097-4191.2024.02.004

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