Review of research on the design of heat dissipation structures based on embedded microchannel chips

XIONG Yuanyuan; LIU Pei; FU Yu; JIAO Binbin; RUI Erming

doi:10.20193/j.ices2097-4191.2024.07.002

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Integrated Circuits and Embedded Systems ›› 2024, Vol. 24 ›› Issue (7) : 12-18. DOI: 10.20193/j.ices2097-4191.2024.07.002

Special Topic of Integrated Circuits Reliability

Review of research on the design of heat dissipation structures based on embedded microchannel chips

XIONG Yuanyuan ¹ ,
LIU Pei ¹^,^* ,
FU Yu ¹ ,
JIAO Binbin ² ,
RUI Erming ¹

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Abstract

Miniaturization of chip/system dimensions and functional composites have led to an increase in power density, accompanied by the growth in heat generation. Addressing this problem has become a great challenge in thermal design and a current research hotspot. This paper discusses the advantages and disadvantages of traditional heat dissipation techniques, and systematically analyzes the embedded microchannel heat dissipation structures at home and abroad. The article focuses on summarizing the principles, thermal performance and innovative solutions of heat dissipation technology based on embedded microchannel chips. Current domestic and international solutions are analyzed, and we summarize the experiences and conclusions of chip thermal design based on embedded microchannels, along with the challenges faced. Finally, the current status and future directions of chip thermal design research are presented.

Key words

chip heat dissipation / embedded microchannel / heat flux density / radiator structure / the layered manifold microchannel array structure

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XIONG Yuanyuan , LIU Pei , FU Yu , et al . Review of research on the design of heat dissipation structures based on embedded microchannel chips[J]. Integrated Circuits and Embedded Systems. 2024, 24(7): 12-18 https://doi.org/10.20193/j.ices2097-4191.2024.07.002

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