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模态框(Modal)标题

 
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Figure/Table detail

Research on reliability simulation method for industrial-chip-featured LDMOS devices under elctromagntic pulse impact
ZHU Yaxing, ZHAO Dongyan, CHEN Yanning, LIU Fang, WU Bo, WANG Kai, LIANG Yingzong, YU Wen, CHI Boming, LIAN Yajun
Integrated Circuits and Embedded Systems, 2024, 24(10): 25-30.   DOI: 10.20193/j.ices2097-4191.2024.0030

Fig. 5 Reliability degradation simulation of the given LDMOS device
Other figure/table from this article
  • Fig.1 Typical electromagnetic interference signal acquisition and analysis in industrial chip environments
  • Fig. 2 Time-domain probability density
  • Fig. 3 Conversion of a complex electromagnetic interference signal to the rectangular pulse signal
  • Fig. 4 Device simulation with electromagnetic boundary conditions

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