Special Topic of Aerospace Integrated Circuits
CHEN Baozhong, SONG Kun, WANG Yingmin, LIU Cunsheng, WANG Xiaohe, ZHAO Hui, XIN Weiping, YANG Lixia, XING Hongyan, WANG Chenjie
Integrated Circuits and Embedded Systems.
2024, 24(3):
19-22.
An investigation on radiation-hardened technology of single event effect(SEE)for power MOSFETs is described in the paper.In order to decrease the gain of the parasitic bipolar junction transistor (BJT),an optimized reversed-body implant process is utilized.Meanwhile,a variable-doping buffer of epitaxy is designed to reduce the gradient of vertical electric-field,leading to a decreased accumulation of carriers nearly the sensitive gate area.Results show under rated Vds and 15 V negative Vgs bias,the single event burnout (SEB) and single event gate rupture (SEGR) LET of radiation-hardened MOSFETs is above 75 MeV·cm2/mg.Under the same radiation condition,the negative gate-source bias of radiation-hardened MOSFETs reaches to 15~17 V.There is an obvious increase comparing to the unhardened MOSFETs of 7~10 V.