模态框(Modal)标题

在这里添加一些文本

模态框(Modal)标题

 
  • Home
  • About Journal
    • About Journal
    • Indexed in
    • Awards
  • Editorial Board
  • Guide for Authors
  • Browse
    • Current Issue
    • Just Accepted
    • Archive
    • Highlights
    • Topic
    • Most Viewed
    • Most Download
    • Most Cited
    • E-mail Alert
    • RSS
  • Subscribe
  • Download
  • Editorial Policy
  • Contact Us

Figure/Table detail

Research on reliability simulation method for industrial-chip-featured LDMOS devices under elctromagntic pulse impact
ZHU Yaxing, ZHAO Dongyan, CHEN Yanning, LIU Fang, WU Bo, WANG Kai, LIANG Yingzong, YU Wen, CHI Boming, LIAN Yajun
Integrated Circuits and Embedded Systems, 2024, 24(10): 25-30.   DOI: 10.20193/j.ices2097-4191.2024.0030

Fig. 2 Time-domain probability density
Other figure/table from this article
  • Fig.1 Typical electromagnetic interference signal acquisition and analysis in industrial chip environments
  • Fig. 3 Conversion of a complex electromagnetic interference signal to the rectangular pulse signal
  • Fig. 4 Device simulation with electromagnetic boundary conditions
  • Fig. 5 Reliability degradation simulation of the given LDMOS device

京ICP备14021798号-2
Copyright © Integrated Circuits and Embedded Systems, All Rights Reserved.
Tel: 010-82317978 
E-mail: jices@buaa.edu.cn
Total visitors:   Visitors of today:   Now online:
Powered by Beijing Magtech Co. Ltd