Design of Modular Intelligent Socket Based on MCU and Cloud Platform

Yin Zhenkai, Wang Zhongxun, Liu Peixue

Integrated Circuits and Embedded Systems ›› 2022, Vol. 22 ›› Issue (11) : 62-64.

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Integrated Circuits and Embedded Systems ›› 2022, Vol. 22 ›› Issue (11) : 62-64.
NEW PRODUCT & TECH

Design of Modular Intelligent Socket Based on MCU and Cloud Platform

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2022, 22(11): 62-64

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