Design of Ultrasonic Array Temperature Measurement System Based on ZYNQ7020

Zhang Kai, Wang Liming, Li Wei, Shi Runzhuo, Li Qiang

Integrated Circuits and Embedded Systems ›› 2023, Vol. 23 ›› Issue (1) : 67-70.

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PDF(1359 KB)
Integrated Circuits and Embedded Systems ›› 2023, Vol. 23 ›› Issue (1) : 67-70.
APPLICATION NOTES

Design of Ultrasonic Array Temperature Measurement System Based on ZYNQ7020

  • Zhang Kai, Wang Liming, Li Wei, Shi Runzhuo, Li Qiang
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Abstract

In the paper,an ultrasonic array temperature measurement system based on ZYNQ is designed to realize real-time and accurate detection of tail flame temperature.In the design,the 8-channel data acquisition card based on ZYNQ7020 is used as the central control system,and the A/D chip,amplification filter circuit and power amplification circuit are used to complete the acquisition of the original data.Using the parallel multi-channel A/D data acquisition system,the parallel transmission and reception timing is designed,the Linux system is integrated in ZYNQ,the DMA kernel driver is designed,and the collected echo data is uploaded to the upper computer.Using signal modulation,cross-correlation algorithm and least square method,the information of two-dimensional temperature field is reconstructed in the upper computer and the corresponding temperature field image is obtained.After testing,the designed ultrasonic temperature measurement system can effectively obtain the echo signal and complete the reconstruction of the two-dimensional temperature field.

Key words

ultrasonic temperature measurement / multi-channel acquisition / ZYNQ7020 / temperature field reconstruction

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Zhang Kai, Wang Liming, Li Wei, Shi Runzhuo, Li Qiang. Design of Ultrasonic Array Temperature Measurement System Based on ZYNQ7020[J]. Integrated Circuits and Embedded Systems. 2023, 23(1): 67-70

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