Special Topic of Aerospace Integrated Circuits
								
							
                        		CHEN  Baozhong, SONG  Kun, WANG  Yingmin, LIU  Cunsheng, WANG  Xiaohe, ZHAO  Hui, XIN  Weiping, YANG  Lixia, XING  Hongyan, WANG  Chenjie
                        	
							
							
								
									Integrated Circuits and Embedded Systems. 
									
                            		2024, 24(3): 
		                            19-22.
                            	
								
								
                            	
							
							
								
                            	
                            
                            
							
	                         	
	                         	
	                         	
	                         	
	                         	
	                         	
	                         	
	  							
	                         
							
								An investigation on radiation-hardened technology of single event effect(SEE)for power MOSFETs is described in the paper.In order to decrease the gain of the parasitic bipolar junction transistor (BJT),an optimized reversed-body implant process is utilized.Meanwhile,a variable-doping buffer of epitaxy is designed to reduce the gradient of vertical electric-field,leading to a decreased accumulation of carriers nearly the sensitive gate area.Results show under rated Vds and 15 V negative Vgs bias,the single event burnout (SEB) and single event gate rupture (SEGR) LET of radiation-hardened MOSFETs is above 75 MeV·cm2/mg.Under the same radiation condition,the negative gate-source bias of radiation-hardened MOSFETs reaches to 15~17 V.There is an obvious increase comparing to the unhardened MOSFETs of 7~10 V.