Special Topic of Aerospace Integrated Circuits
CHEN Baozhong, SONG Kun, WANG Yingmin, LIU Cunsheng, WANG Xiaohe, ZHAO Hui, XIN Weiping, YANG Lixia, XING Hongyan, WANG Chenjie
An investigation on radiation-hardened technology of single event effect(SEE)for power MOSFETs is described in the paper.In order to decrease the gain of the parasitic bipolar junction transistor (BJT),an optimized reversed-body implant process is utilized.Meanwhile,a variable-doping buffer of epitaxy is designed to reduce the gradient of vertical electric-field,leading to a decreased accumulation of carriers nearly the sensitive gate area.Results show under rated Vds and 15 V negative Vgs bias,the single event burnout (SEB) and single event gate rupture (SEGR) LET of radiation-hardened MOSFETs is above 75 MeV·cm2/mg.Under the same radiation condition,the negative gate-source bias of radiation-hardened MOSFETs reaches to 15~17 V.There is an obvious increase comparing to the unhardened MOSFETs of 7~10 V.