Integrated Circuits and Embedded Systems

Research on reliability evaluation standards for system-in-package on physics-of-failure

LIU Yingying, WANG Zhihui, LIU Wenbao, FU Wanyue, LIU Pei

Integrated Circuits and Embedded Systems, 2025, 25(11): 54-61. DOI: 10.20193/j.ices2097-4191.2025.0055

Fig. 1 Reliability prediction workflow based on CALCE SARA

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Fig. 2 Reliability prediction workflow compliant with IEEE 1413 standard
Fig. 3 PoF-based comprehensive scheme for SiP reliability evaluation
Fig. 4 A specific SiP product architecture
Fig. 5 Load response characterization of a specific SiP device
Fig. 6 Mechanism model initialization
Fig. 7 Experimental dataset generation
Fig. 8 Lifetime prediction visualization
Fig. 9 Failure prediction summary table
Fig. 10 Reliability assessment outcomes
Table 1 Normalized characteristic parameters of sip module(range transformation)