Artificial intelligence devices are miniaturized devices that provide system functions, serving as hardware carriers and foundations for spatial environment perception, autonomous judgment, and autonomous task planning. Before being applied in aerospace, these new types of components still face many challenges such as maturity, reliability, radiation resistance, and aerospace applicability. Starting from the analysis of the current development status of artificial intelligence devices both domestically and internationally, this article examines the challenges and countermeasures faced by the aerospace applications of artificial intelligence devices, provides typical cases of quality assurance for artificial intelligence devices, and summarizes relevant suggestions for the subsequent aerospace applications of artificial intelligence devices.

This work presents a failure analysis study on domestic operational amplifiers, revealing that the main cause of device failure is the short circuit of stacked MIS capacitors induced by process changes. Under low electric fields, the capacitors perform normally, but under high electric fields, Fowler-Nordheim tunneling and defect accumulation caused by hot electron collisions ultimately lead to capacitor short circuits. Using Sentaurus TCAD simulations, we verified the impact of doping atom concentration differences at the interface on the oxide layer growth rate and proposed process improvement recommendations to enhance the reliability of domestic chips.

With the development of high-power microwave technology, strong electromagnetic technologies such as ultra-wideband and high power pose an increasing threat to electronic equipment. Using high-power microwaves to destroy electronic information equipment has become an important way to interfere with communication systems. The protection of high-power microwaves is mainly divided into front-door protection and back-door protection. As an important microwave device for front-door protection, the limiter is also facing higher and higher requirements. This paper first introduces the device characteristics and performance advantages of GaN materials and Schottky diodes, and then introduces the principle and circuit structure of the limiter based on semiconductor devices, and discusses the research progress of the new generation of high-power microwave limiting technology based on GaN Schottky diodes.

Communication technology is closely related to social development. The realization of RF circuit had promoted the level of communication technology, and had become one of the hot spots of RF circuit. The difference between RF circuit and digital circuit reflected in the packaging technology. This paper took packaging design and process as the title, and introduced the development status, technical requirements and process route of RF circuit. Electrical packaging consisted of basic principle, packaging design and implementation, which had guiding significance for RF circuit packaging.

As the rapid growth of the signal bandwidth in aerospace data communications, the data rate of laser diode driver(LDD) in aerospace optical fiber communication has enter the era of hundred-gigabits. For the sake of radiation harden and high reliability design, the introduction of extra parasitic factor requires more efforts in the circuit design to compensate the loss of bandwidth at high frequency. This work proposes an adaptive continue time linear equalizer(CTLE) which is based on a SiGe BiCMOS platform giving a programmable loss compensating capability up to 16 dB at 14 GHz.It has the capable of adaptive gain compensation adjustment, supporting up to 25 Gb/s NRZ signal transmission.

The space radiation-resistant optical transceiver module is capable of realizing high-speed parallel optical-electrical conversion and transmission functions within the space application environment. By employing optical means, it achieves the transmission of high-speed signals, thereby addressing the bottleneck issue of data transmission in spaceborne systems and reducing the overall system weight through an optimized transmission architecture. This advancement holds significant milestone value. This paper provides a detailed analysis of the module's working principles, structural composition, and associated characteristics. Furthermore, it evaluates the functional performance, quality reliability, and environmental adaptability of a particular 12-channel parallel optical transceiver module that is resistant to radiation, considering its specific application context. Based on the product definition and user requirements, a standardized index system and assessment criteria have been developed in a forward-thinking approach, offering guidance for the standardization of novel optical module products.